Tags: Security

Pervasive computing — IoT, edge, cloud, data center, and backCadence announced it has found a cost-conscience way to scale capacity for 3D electromagnetic (EM) simulations using a hybrid cloud consisting of local computing resources and cloud services from Amazon Web Service (AWS). Data stays safe on the local resources, and, if more computing resources are needed, encrypted simulation-specific data goes to the cloud. The 3D finite element method (FEM) simulation is part of Cadence’s Clarity 3D Solver 3D, which under this new method will automatically set up and run the simulation in a private, secure AWS chamber. The user defines the number of compute cores to be accessed and when. The data in the AWS chamber is deleted after the compute work has been returned to the on-prem computers. “We utilize Clarity 3D Solver with on-premises...

Pervasive computing — IoT, edge, cloud, data center, and backCombining AI with IoT not only gives another acronym AIoT, or Artificial Intelligence of Things, but it puts AI systems on the edge. Infineon Technologies has released its ModusToolbox Machine Learning to make it possible to run deep learning-based workloads on Infineon’s PSoC microcontrollers. The toolbox has middleware, software libraries, and special tools for designers to deploy machine learning models efficiently. Developers can use the deep learning framework they prefer, and a feature helps designers fit or optimize the machine learning in a resource-constrained embedded system. Subject to regulatory approval, STMicroelectronics is acquiring Cartesiam, an edge AI software firm based in Toulon, France, founded in 2016. Cartesiam, the maker of NanoEdge AI Studio, develops tools...

Pervasive computing — IoT, edge, cloud, data center, and backFoxconn (also known as Hon Hai Technology Group) is forming a joint venture (JV) with Yageo Group, a component production and process management company for EVs and other high-end electronics, to focus on the development of semiconductors under $2 USD, which they call “small ICs.” Through the JV, a new company called XSemi will develop semiconductors to provide a stable supply to both companies and other customers. According to a press release. “Hon Hai has built capabilities within semiconductor equipment, design services, IC design in 5G, AI, CIS (CMOS Image Sensors), and display driver, foundry fabs, and advanced packaging.” Yageo brings component production and sales. “Yageo aims to create a one-stop shop for its customers,” said Yageo chairman Pierre Chen in the press...

Pervasive computing — IoT, edge, cloud, data center, and backArm shared new features and some design wins for its Neoverse V1 and N2 platforms, which it introduced in September 2020. Neoverse V1 is optimized for high-performance computing. Arm has licensing wins from India’s Ministry of Electronics and Information Technology (MeitY) for its exascale HPC project; and European exascale computing company Sipearl’s supercomputing CPU; among others. Marvell is using Neoverse N2 cores n its  next generation of OCTEON DPUs. Arm also unveiled its  CMN-700 fabric for V1 and N2. Cadence now has 5nm and 7nm RTL-to-GDS digital full flow Rapid Adoption Kits (RAKs) ready for Arm’s Neoverse V1 and Neoverse N2 platforms, which target hyperscale computing and 5G communications SoC development. The RAKs are suitable for advanced-node designs, including...

Automotive & transportationChip shortages continue to affect automotive production lines and the bottom line of automotive OEMs. Jaguar Land Rover and Daimler this week said they will reduce production because chip supply issues. Other car companies have or are planning to temporarily shut down production lines. Renault, GM, Ford, Fiat Chrysler (now Stellantis), Volkswagen, Nissan, and Honda have all reported some shutdowns or slowdowns. The shortages are also now affecting the medium and heavy commercial vehicle (MHCV) sector, reports I.H.S. Markit in a blog. SEMI and the think tank Center for Automotive Research (CAR) plan to work together on the automotive supply chain issues. The two organizations signed a Memorandum of Understanding (MOU) this week. Through the MOU, the organizations want to connect microelectronics manufacturing and...